6

CD54HC4051, CD74HC4051

CD54HCT4051, CD74HCT4051, CD54HC4052, CD74HC4052, CD54HCT4052

CD74HCT4052, CD54HC4053, CD74HC4053, CD54HCT4053, CD74HCT4053

SCHS122M – NOVEMBER 1997 – REVISED MAY 2019

www.ti.com

Product Folder Links: CD54HC4051 CD74HC4051 CD54HCT4051 CD74HCT4051 CD54HC4052 CD74HC4052

CD54HCT4052 CD74HCT4052 CD54HC4053 CD74HC4053 CD54HCT4053 CD74HCT4053

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Copyright © 1997–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages referenced to GND unless otherwise specified.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC – VEE DC supply voltage

–0.5

10.5

V

VCC

DC supply voltage

–0.5

7

V

VEE

DC supply voltage

0.5

–7

V

IIK

DC input diode current

VI < – 0.5 V or VI > VCC + 0.5 V

±20

mA

IOK

DC switch diode current

VI < VEE – 0.5 V or VI > VCC + 0.5 V

±20

mA

DC switch current(2)

VI > VEE – 0.5 V or VI < VCC + 0.5 V

±25

mA

ICC

DC VCC or ground current

±50

mA

IEE

DC VEE current

–20

mA

TJMAX

Maximum junction temperature

150

°C

TLMAX

Maximum lead temperature

Soldering 10 s

300

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±500

V

Charged device model (CDM), per JEDEC specification JESD22-C101 or

ANSI/ESDA/JEDEC JS-002(2)

±200

(1)

For maximum reliability, nominal operating conditions must be selected so that operation is always within the ranges specified in the

Recommended Operating Conditions table.

(2)

All voltages referenced to GND unless otherwise specified.

(3)

In certain applications, the external load resistor current may include both VCC and signal line components. To avoid drawing VCC

current when switch current flows into the transmission gate inputs, the voltage drop across the bidirectional switch must not exceed

0.6 V (calculated from rON values shown in Electrical Characteristics: HC Devices and Electrical Characteristics: HCT Devices tables).

No VCC current will flow through RL if the switch current flows into terminal 3 on the HC and HCT4051; terminals 3 and 13 on the HC

and HCT4052; terminals 4, 14, and 15 on the HC and HCT4053.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX UNIT

VCC

Supply voltage range

(TA = full package temperature

range)(2)

CD54 and 74HC types

2

6

V

CD54 and 74HCT types

4.5

5.5

VCC –

VEE

Supply voltage range

(TA = full package temperature range)

CD54 and 74HC types, CD54 and 74HCT

types (see Figure 1)

2

10

V

VEE

Supply voltage range

(TA = full package temperature

range)(3)

CD54 and 74HC types, CD54 and 74HCT

types (see Figure 2)

0

–6

V

VI

DC input control voltage

GND

VCC

V

VIS

Analog switch I/O voltage

VEE

VCC

V

TA

Operating temperature

–55

125

°C

tr, tf

Input rise and fall times

2 V

0

1000

ns

4.5 V

0

500

6 V

0

400