ADP3118

Rev. 0 | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VCC

−0.3 V to +15 V

BST

−0.3 V to VCC +15 V

BST to SW

−0.3 V to +15 V

SW

DC

−5 V to +15 V

<200 ns

−10 V to +25 V

DRVH

DC

SW − 0.3 V to BST + 0.3 V

<200 ns

SW − 2 V to BST + 0.3 V

DRVL

DC

−0.3 V to VCC + 0.3 V

<200 ns

−2 V to VCC + 0.3 V

IN, OD

−0.3 V to 6.5 V

2-Layer Board

123°C/W

4-Layer Board

90°C/W

Operating Ambient Temperature

Range

0°C to 85°C

Junction Temperature Range

0°C to 150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature Range

Soldering (10 sec)

300°C

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

260°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Unless otherwise specified, all voltages are referenced to PGND.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-

tion or loss of functionality.