TC1017

DS21813B-page 2

 2003 Microchip Technology Inc.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Input Voltage ....................................................................6.5V

Power Dissipation .......................... Internally Limited (Note 7)

† Notice: Stresses above those listed under "Maximum

Ratings" may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operation listings of this specification is not implied. Exposure

to maximum rating conditions for extended periods may affect

device reliability.

PIN FUNCTION TABLE

Name

Function

SHDN

Shutdown control input.

NC

No connect

GND

Ground terminal

Regulated voltage output

Unregulated supply input

ELECTRICAL CHARACTERISTICS

Boldface type specifications apply for junction temperatures of – 40°C to +125°C.

Parameter

Sym

Min

Typ

Max

Units

Test Conditions

Input Operating Voltage

2.7

—

6.0

V

Note 1

Maximum Output Current

150

——

mA

Output Voltage

V

Note 2

V

—

40

—ppm/°C Note 3

Line Regulation

—0.04

0.2

%/V

Load Regulation (Note 4)

—0.38

1.5

Dropout Voltage (Note 5)

—

—

—

—

2

90

180

285

—

200

350

500

mV

Supply Current

—53

90

µA

Shutdown Supply Current

—0.05

2

µA

SHDN = 0V

Power Supply Rejection Ratio

PSRR

—

58

—

dB

Wake-Up Time

(from Shutdown Mode)

—10

—

µs

f = 100 Hz

Note 1:

The minimum V

2:

V

3:

4:

Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

5:

Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal

value at a 1V differential.

6:

Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

7:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction-to-air (i.e. T

dissipation causes the device to initiate thermal shutdown. Please see Section 5.1, “Thermal Considerations”, for

more details

.

TCVOUT

VOUTMAX VOUTMIN

–

() 10

6

×

VOUT

T

∆

×

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