SPECIFICATION AND PERFORMANCE

SERIES:

115B Series

FILE:

115B Series_spec

DATE:

2012/12/12

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-4 -

Heat Resistance

No appearance

damaged

(EIA 364-17 )

Mate a dummy card and expose to 70±2℃

for 96Hr Upon completion of the exposure

period,the test specimens shall be

conditioned at ambient room conditions

for 1 to 2Hr,after which the specified

measurements shall be performed.

SOLDER ABILITY

Item

Requirement

Test Condition

Solderability

The surface of the

portion to be soldered

shall at least 95%

covered

(EIA 364-52 )

After one hour steam aging.

The object of test procedure is to detail a

unfirm test methods for determining sim

card connector solderability.

The test procedure contained here utilizes

the solder dip technique. It is not intended

to test or evaluate solder cup, solder

eyelet, other hand-soldered type or SMT

type terminations.

Resistance to

Soldering Heat

260℃±5℃ 10Sec

Peak temperature: 260℃±5℃ 10Sec

Soldering temperature: 230℃

Preheating temperature: 150~180℃