DA1017.002

29 May, 2002

6(6)

ORDERING INFORMATION

Product Code

Product

Package

Comments

MAS1017ATC1

AM-Receiver IC

Wafer, EWS-tested

wafer thickness 400 µm

MAS1017ATC1-1

AM-Receiver IC

Dice on sticky tape

wafer thickness 400 µm,

sawn wafer, tape ring 6”, non

UV tape, tape not expanded

Please contact Micro Analog Systems Oy for other wafer thickness, sawn wafer delivery as well as SMD

package options.

LOCAL DISTRIBUTOR

MICRO ANALOG SYSTEMS OY CONTACTS

Micro Analog Systems Oy

Kamreerintie 2, P.O.Box 51

FIN-02771 Espoo, FINLAND

Tel. +358 9 80 521

Fax +358 9 805 3213

http://www.mas-oy.com

NOTICE

Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or

performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown

in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that

the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog

Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.