RT4841 datasheet(14/16 Pages) RICHTEK

14 / 16 page

RT4841

DS4841-00 May 2021

www.richtek.com

is a registered trademark of Richtek Technology Corporation.

Figure 2. Derating Curve of Maximum Power Dissipation

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

025

100

125

Ambient Temperature (°C)

Four-Layer PCB

Layout Considerations

For high frequency switching power supplies, the PCB

layout is important to get good regulation, high efficiency

and stability. The following descriptions are the guidelines

for better PCB layout.

 For good regulation, place the power components as

close as possible. The traces should be wide and short

enough especially for the high current output loop.

 The feedback voltage divider resistors must be near the

feedback pin. The divider center trace must be shorter

and the trace must be kept away from any switching

nodes.

 The compensation circuit should be kept away from the

power loops and be shielded with a ground trace to

prevent any noise coupling.

 Minimize the size of the SW node and keep it wide and

shorter. Keep the SW node away from the FB.

 The exposed pad of the chip should be connected to a

strong ground plane for maximum thermal consideration.

SWI

PGND

GND

SWO

GND

VIN

PGND

Place the power

components as close to

the IC as possible. The

traces should be wide

and short especially for

the high current loop.

The exposed pad of

the chip should be

connected to ground

plane for thermal

consideration.

GND consists of input

and output capacitor

grounds and should be

wide and short enough

to connect to a ground

plane.

Connect this pin with a

decoupling capacitor.

GND

Minimize the size of

the SW node and

keep its traces as

wide and short as

possible.

GND

Figure 3. PCB Layout Guide

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