CS51031

http://onsemi.com

2

ORDERING INFORMATION

Device

Operating

Temperature Range

Package

CS51031YD8

−40

SOIC−8

98 Units / Rail

CS51031YD8G

SOIC−8

(Pb−Free)

98 Units / Rail

CS51031YDR8

SOIC−8

2500 / Tape & Reel

CS51031YDR8G

SOIC−8

(Pb−Free)

2500 / Tape & Reel

CS51031GD8

0

SOIC−8

98 Units / Rail

CS51031GD8G

SOIC−8

(Pb−Free)

98 Units / Rail

CS51031GDR8

SOIC−8

2500 / Tape & Reel

CS51031GDR8G

SOIC−8

(Pb−Free)

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MAXIMUM RATINGS

Rating

Value

Unit

20

V

20

V

20

V

6.0

V

Peak Output Current

1.0

A

Steady State Output Current

200

mA

150

°C

−40 to 85

°C

−65 to 150

°C

ESD (Human Body Model)

2.0

kV

Lead Temperature Soldering:

Wave Solder: (through hole styles only) (Note 1)

Reflow (SMD styles only) (Note 2)

260 peak

230 peak

°C

°C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. 10 sec. maximum.

2. 60 sec. max above 183

°C.

PACKAGE LEAD DESCRIPTION

Package Pin Number

Pin Symbol

Function

1

Driver pin to gate of external P−Ch FET.

2

PGND

Output power stage ground connection.

3

Oscillator frequency programming capacitor.

4

GND

Logic ground.

5

Feedback voltage input.

6

Logic supply voltage.

7

CS

Soft−Start and fault timing capacitor.

8

Driver supply voltage.