STM32L010RB datasheet(85/89 Pages) STMICROELECTRONICS

85 / 89 page

DS12319 Rev 3

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STM32L010RB

Package information

Device marking for LQFP64

Figure 29 gives an example of topside marking versus pin 1 position identifier location.

The printed markings may differ depending on the supply chain.

Other optional marking or inset/upset marks depending on supply-chain operations, are not

indicated below.

Figure 29. LQFP64 marking example (package top view)

1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet

qualified and therefore not approved for use in production. ST is not responsible for any consequences

resulting from such use. In no event will ST be liable for the customer using any of these engineering

samples in production. ST’s Quality department must be contacted prior to any decision to use these

engineering samples to run a qualification activity.

7.2

Thermal characteristics

The maximum chip-junction temperature, TJ max, in °C, may be calculated using the

following equation:

TJ max = TA max + (PD max × ϴJA)

Where:

•

TA max is the maximum ambient temperature in °C

•

ϴJA is the package junction-to-ambient thermal resistance in °C/W

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max= Σ(VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

MSv48111V1

Revision code

STM32L

Product identification

(1)

Date code

YWW

Pin 1

indentifier

010RBT6

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