1999 Nov 15

3

Philips Semiconductors

Product specification

Ultra fast low-loss rectifier

BYD127

THERMAL CHARACTERISTICS

Note

1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper

≥40 µm, see Fig.7.

For more information please refer to the

“General part of the associated handbook”.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

30

K/W

thermal resistance from junction to ambient

note 1

150

K/W