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TPS25751D 데이터시트(PDF) 77 Page - Texas Instruments |
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TPS25751D 데이터시트(HTML) 77 Page - Texas Instruments |
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77 / 89 page ![]() www.ti.com PACKAGE OUTLINE C 32X 0.25 0.15 2.8 0.05 32X 0.45 0.25 1 MAX (0.2) TYP 0.05 0.00 28X 0.4 2X 2.8 2X 2.8 A 4.1 3.9 B 4.1 3.9 0.25 0.15 0.45 0.25 4X (0.45) VQFN - 1 mm max height RSM0032B PLASTIC QUAD FLATPACK - NO LEAD 4219108/A 11/2017 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 8 17 24 9 16 32 25 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD DETAIL SEE TERMINAL SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 33 OPTIONAL TERMINAL SCALE 3.000 DETAIL TYPICAL www.ti.com TPS25751 SLVSH93 – OCTOBER 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 77 Product Folder Links: TPS25751 |
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