TSL2580FN datasheet(45/53 Pages) OSRAM

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ams Datasheet

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[v1-00] 2016-Apr-05

TSL2580, TSL2581 − Manufacturing Information

The package has been tested and have demonstrated an ability

to be reflow soldered to a PCB substrate. The process,

equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 47:

TSL2580/81 Solder Reflow Profile

Figure 48:

TSL2580/TSL2581 Solder Reflow Profile Graph

Note(s):

1. Not to scale - for reference only.

Parameter

Reference

Device

Average temperature gradient in preheating

2.5°C/s

Soak time

tsoak

2 to 3 minutes

Time above 217°C

Max 60 s

Time above 230°C

Max 50 s

Time above Tpeak −10°C

Max 10 s

Peak temperature in reflow

Tpeak

260°C (-0°C/+5°C)

Temperature gradient in cooling

Max −5°C/s

Manufacturing Information

tsoak

Tpeak

Not to scale — for reference o

Time (s)

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