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MPC8323CVRADDC 데이터시트(PDF) 47 Page - Freescale Semiconductor, Inc |
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MPC8323CVRADDC 데이터시트(HTML) 47 Page - Freescale Semiconductor, Inc |
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47 / 80 page ![]() MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0 Freescale Semiconductor 47 Package and Pin Listings Figure 41 provide the AC test load for the USB. Figure 41. USB AC Test Load 21 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the MPC8323E PBGA,” and Section 21.2, “Mechanical Dimensions of the MPC8323E PBGA,” for information on the PBGA. 21.1 Package Parameters for the MPC8323E PBGA The package parameters are as provided in the following list. The package type is 27 mm × 27 mm, 516 PBGA. Package outline 27 mm × 27 mm Interconnects 516 Pitch 1.00 mm Module height (typical) 2.25 mm Solder Balls 62 Sn/36 Pb/2 Ag (ZQ package) 95.5 Sn/0.5 Cu/4Ag (VR package) Ball diameter (typical) 0.6 mm 21.2 Mechanical Dimensions of the MPC8323E PBGA Figure 42 the mechanical dimensions and bottom surface nomenclature of the MPC8323E, 516-PBGA package. Skew among RXP, RXN, and RXD tUSRPND — 100 ns Low speed transitions Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(state)(signal) for receive signals and t(first two letters of functional block)(state)(signal) for transmit signals. For example, tUSRSPND symbolizes USB timing (US) for the USB receive signals skew (RS) among RXP, RXN, and RXD (PND). Also, tUSTSPN symbolizes USB timing (US) for the USB transmit signals skew (TS) between TXP and TXN (PN). 2. Skew measurements are done at OVDD/2 of the rising or falling edge of the signals. Table 54. USB General Timing Parameters (continued) Parameter Symbol1 Min Max Unit Notes Output Z0 = 50 Ω OVDD/2 RL = 50 Ω |
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