전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

MPC8323CVRADDC 데이터시트(PDF) 47 Page - Freescale Semiconductor, Inc

부품명 MPC8323CVRADDC
상세설명  PowerQUICC??II Pro Integrated Communications Processor Family Hardware Specifications
PDF  80 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  FREESCALE [Freescale Semiconductor, Inc]
홈페이지  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8323CVRADDC 데이터시트(HTML) 47 Page - Freescale Semiconductor, Inc

Back Button MPC8323CVRADDC Datasheet HTML 43Page - Freescale Semiconductor, Inc MPC8323CVRADDC Datasheet HTML 44Page - Freescale Semiconductor, Inc MPC8323CVRADDC Datasheet HTML 45Page - Freescale Semiconductor, Inc MPC8323CVRADDC Datasheet HTML 46Page - Freescale Semiconductor, Inc MPC8323CVRADDC Datasheet HTML 47Page - Freescale Semiconductor, Inc MPC8323CVRADDC Datasheet HTML 48Page - Freescale Semiconductor, Inc MPC8323CVRADDC Datasheet HTML 49Page - Freescale Semiconductor, Inc MPC8323CVRADDC Datasheet HTML 50Page - Freescale Semiconductor, Inc MPC8323CVRADDC Datasheet HTML 51Page - Freescale Semiconductor, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 47 / 80 page
background image
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0
Freescale Semiconductor
47
Package and Pin Listings
Figure 41 provide the AC test load for the USB.
Figure 41. USB AC Test Load
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the
MPC8323E PBGA,” and Section 21.2, “Mechanical Dimensions of the MPC8323E PBGA,” for
information on the PBGA.
21.1
Package Parameters for the MPC8323E PBGA
The package parameters are as provided in the following list. The package type is 27 mm
× 27 mm, 516
PBGA.
Package outline
27 mm
× 27 mm
Interconnects
516
Pitch
1.00 mm
Module height (typical)
2.25 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
Ball diameter (typical)
0.6 mm
21.2
Mechanical Dimensions of the MPC8323E PBGA
Figure 42 the mechanical dimensions and bottom surface nomenclature of the MPC8323E, 516-PBGA
package.
Skew among RXP, RXN, and RXD
tUSRPND
100
ns
Low speed transitions
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(state)(signal) for receive signals
and t(first two letters of functional block)(state)(signal) for transmit signals. For example, tUSRSPND symbolizes USB timing (US) for the
USB receive signals skew (RS) among RXP, RXN, and RXD (PND). Also, tUSTSPN symbolizes USB timing (US) for the USB
transmit signals skew (TS) between TXP and TXN (PN).
2. Skew measurements are done at OVDD/2 of the rising or falling edge of the signals.
Table 54. USB General Timing Parameters (continued)
Parameter
Symbol1
Min
Max
Unit
Notes
Output
Z0 = 50 Ω
OVDD/2
RL = 50 Ω



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com