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FDN358P 데이터시트(PDF) 1 Page - EVER SEMICONDUCTOR CO.,LIMITED |
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FDN358P 데이터시트(HTML) 1 Page - EVER SEMICONDUCTOR CO.,LIMITED |
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1 / 5 page ![]() General Description These devices are well suited for portable electronics applications: load switching and power management, battery charging circuits, and DC/DC conversion. Features • • Low gate charge (4 nC typical) • High performance trench technology for extremely low R DS(ON) . • High power version of industry Standard SOT-23 package. Identical pin-out to SOT-23 with 30% higher power handling capability. D S G Absolute Maximum Ratings TA=25 oC unless otherwise noted Symbol Parameter Ratings Units VDSS Drain-Source Voltage –30 V VGSS Gate-Source Voltage ±20 V ID Drain Current – Continuous (Note 1a) –1.5 A – Pulsed –5 Power Dissipation for Single Operation (Note 1a) 0.5 PD (Note 1b) 0.46 W TJ, TSTG Operating and Storage Junction Temperature Range –55 to +150 °C Thermal Characteristics RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 250 °C/W RθJC Thermal Resistance, Junction-to-Case (Note 1) 75 °C/W FDN358 Rev:2023A2 1 SOT–23 1. GATE 2. SOURCE 3. DRAIN VDS (V) = -30V ID = -1.5 A RDS(ON) 90m (VGS = -10V) RDS(ON) 150m (VGS = -4.5V) •• • • P−CHANNEL MOSFET |
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