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MPC826XACVR 데이터시트(PDF) 34 Page - Freescale Semiconductor, Inc |
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MPC826XACVR 데이터시트(HTML) 34 Page - Freescale Semiconductor, Inc |
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34 / 52 page ![]() MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 34 Freescale Semiconductor Pinout Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view. Figure 14. Side View of the TBGA Package Table 20 shows the pinout list of the MPC826xA. Table 21 defines conventions and acronyms used in Table 20. Table 20. Pinout List Pin Name Ball BR W5 BG F4 ABB/IRQ2 E2 TS E3 A0 G1 A1 H5 A2 H2 A3 H1 A4 J5 A5 J4 A6 J3 A7 J2 A8 J1 A9 K4 A10 K3 A11 K2 A12 K1 A13 L5 A14 L4 A15 L3 A16 L2 A17 L1 Soldermask Copper Traces Die Copper Heat Spreader (Oxidized for Insulation) 1.27 mm Pitch Glob-Top Dam Wire Bonds Etched Pressure Sensitive Die Glob-Top Filled Area Polymide Tape Cavity Adhesive Attach View |
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