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MPC8540CVT667JC 데이터시트(PDF) 12 Page - Freescale Semiconductor, Inc |
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MPC8540CVT667JC 데이터시트(HTML) 12 Page - Freescale Semiconductor, Inc |
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12 / 104 page ![]() MPC8540 Integrated Processor Hardware Specifications, Rev. 4 12 Freescale Semiconductor Power Characteristics The estimated power dissipation on the AVDD supplies for the MPC8540 PLLs is shown in Table 5. Table 6 provides estimated I/O power numbers for each block: DDR, PCI, Local Bus, RapidIO, TSEC, and FEC. 333 667 6.3 9.3 W 833 6.9 10.9 1000 6 11.3 15.9 Notes: 1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. 2. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, air flow, power dissipation of other components on the board, and board thermal resistance. Any customer design must take these considerations into account to ensure the maximum 105 °C junction temperature is not exceeded on this device. 3. Typical Power is based on a nominal voltage of VDD = 1.2 V, a nominal process, a junction temperature of Tj = 105 °C, and a Dhrystone 2.1 benchmark application. 4. Thermal solutions will likely need to design to a number higher than Typical Power based on the end application, TA target, and I/O power. 5. Maximum power is based on a nominal voltage of VDD = 1.2 V, worst case process, a junction temperature of Tj = 105 °C, and an artificial smoke test. 6. The nominal recommended VDD is 1.3 V for this speed grade. Table 5. MPC8540 AVDD Power Dissipation AVDDnTypical 1 Unit AVDD10.007 W AVDD20.014 W Notes: 1. VDD = 1.2 V (1.3 V for 1.0 GHz device), TJ = 105°C Table 6. Estimated Typical I/O Power Consumption Interface Parameter GVDD (2.5 V) OVDD (3.3 V) LVDD (3.3 V) LVDD (2.5 V) Units Notes DDR I/O CCB = 200 MHz 0.46 W 1 CCB = 266 MHz 0.59 CCB = 300 MHz 0.66 CCB = 333 MHz 0.73 Table 4. MPC8540 VDD Power Dissipation 1,2 CCB Frequency (MHz) Core Frequency (MHz) Typical Power3,4 Maximum Power5 Unit |
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