4 Pin Configuration and Functions

A

B

C

D

CLK INH

CLK

GND

SH/LD

H

Q

H

G

F

CLR

E

PAD

SER

V

CC

2

3

4

5

6

7

8

15

14

13

12

11

10

9

1

16

Figure 4-1. BQB Package, 16-Pin WQFN (Top View)

1

2

3

7

4

5

6

14

13

12

8

11

10

9

GND

D

B

A

VCC

15

16

CLK

E

F

G

H

CLK INH

C

CLR

QH

SH/LD

SER

Figure 4-2. D or PW Package, 16-Pin SOIC or

TSSOP (Top View)

Table 4-1. Pin Functions

PIN

TYPE(1)

DESCRIPTION

NAME

NO.

SER

1

I

Serial data input

A

2

I

Parallel input A

B

3

I

Parallel input B

C

4

I

Parallel input C

D

5

I

Parallel input D

CLK INH

6

I

Clock inhibit input

CLK

7

I

Clock input

GND

8

G

Ground

CLR

9

I

Clock for Channel 2, rising edge triggered

E

10

O

Parallel input E

F

11

I

Parallel input F

G

12

I

Parallel input G

QH

13

I

Serial output

H

14

I

Parallel input H

SH/LD

15

I

Enable shifting when input is high, enable loading data when input is low

VCC

16

P

Positive supply

Thermal Pad(2)

—

The thermal pad can be connected to GND or left floating. Do not connect to any other

signal or supply.

(1)

I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.

(2)

BQB package only

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SN74LVC166A

SCLSA15 – MAY 2024

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