8 Device and Documentation Support

8.1 Documentation Support (Analog)

8.1.1 Related Documentation

PARTS

PRODUCT FOLDER

SAMPLE & BUY

TECHNICAL

DOCUMENTS

TOOLS &

SOFTWARE

SUPPORT &

COMMUNITY

CD54ACT138

Click here

Click here

Click here

Click here

Click here

CD74ACT138

Click here

Click here

Click here

Click here

Click here

8.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

Changes from Revision B (April 2024) to Revision C (July 2024)

Page

• Added BQB and PW packages to Device Information table, Pin Configuration and Functions section, and

Thermal Information table...................................................................................................................................1

• Changed E and M packages to N and D throughout data sheet........................................................................1

Changes from Revision A (February 2003) to Revision B (April 2024)

Page

• Added Package Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Device

Functional Modes,Application and Implementation section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ............................................................................. 1

• Updated RθJA values: M = 73 to 106.6, all values in °C/W .............................................................................. 4

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CD54ACT138, CD74ACT138

SCHS329C – JANUARY 2003 – REVISED JULY 2024

Copyright © 2024 Texas Instruments Incorporated

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Product Folder Links: CD54ACT138 CD74ACT138