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M24256E-FDW6TP 데이터시트(PDF) 36 Page - STMicroelectronics

부품명 M24256E-FDW6TP
상세설명  256-Kbit serial I²C bus EEPROM with configurable device address and preprogrammed device address
PDF  46 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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M24256E-FDW6TP 데이터시트(HTML) 36 Page - STMicroelectronics

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10.3
UFDFPN8 (DFN8) package information
This UFDFPN is a 8-lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package.
Figure 24. UFDFPN8 - Outline
Top view
Pin #1
ID marking
Side view
Seating plane
eee
ccc
C
C
C
C
C
B
A
1 2
N
D
E
aaa
aaa
A
A1
2x
2x
Datum A
Terminal tip
Detail “A”
Even terminal
L1
L3
L
e
e/2
Pin #1
ID marking
Bottom view
See Detail “A”
e
e
1 2
ND-1 x
D2
L1
L3
E2
K
L
b
1.
Maximum package warpage is 0.05 mm.
2.
Exposed copper is not systematic and can appear partially or totally according to the cross section.
3.
Drawing is not to scale.
4.
The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating
(not connected) in the end application.
M24256E-F
UFDFPN8 (DFN8) package information
DS12687 - Rev 3
page 36/46



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