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M24256E-FDW6TP 데이터시트(PDF) 38 Page - STMicroelectronics

부품명 M24256E-FDW6TP
상세설명  256-Kbit serial I²C bus EEPROM with configurable device address and preprogrammed device address
PDF  46 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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M24256E-FDW6TP 데이터시트(HTML) 38 Page - STMicroelectronics

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10.4
UFDFPN5 (DFN5) package information
UFDFPN5 is a 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package.
Figure 26. UFDFPN5 - Outline
Top view
(marking side)
D
E
Side view
A1
A
Bottom view
(pads side)
D1
E1
b
k
L
e
Pin 1
X
Y
L1
1.
Maximum package warpage is 0.05 mm.
2.
Exposed copper is not systematic and can appear partially or totally according to the cross section.
3.
Drawing is not to scale.
4.
On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from
the orientation of the marking. When reading the marking, pin 1 is below the upper left package corner.
Table 19. UFDFPN5 - Mechanical data
Symbol
millimeters
inches
Min
Typ
Max
Min
Typ
Max
A
0.500
0.550
0.600
0.0197
0.0217
0.0236
A1
0.000
-
0.050
0.0000
-
0.0020
b(1)
0.175
0.200
0.225
0.0069
0.0079
0.0089
D
1.600
1.700
1.800
0.0630
0.0669
0.0709
D1
1.400
1.500
1.600
0.0551
0.0591
0.0630
E
1.300
1.400
1.500
0.0512
0.0551
0.0591
E1
0.175
0.200
0.225
0.0069
0.0079
0.0089
X
-
0.200
-
-
0.0079
-
Y
-
0.200
-
-
0.0079
-
e
-
0.400
-
-
0.0157
-
L
0.500
0.550
0.600
0.0197
0.0217
0.0236
L1
-
0.100
-
-
0.0039
-
k
-
0.400
-
-
0.0157
-
1. Dimension b applies to plated terminal and is measured between 0.15 and 0.30mm from the terminal tip.
M24256E-F
UFDFPN5 (DFN5) package information
DS12687 - Rev 3
page 38/46



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