ADN2913 datasheet(9/35 Pages) AD

9 / 35 page

Data Sheet

ADN2913

Rev. B | Page 9 of 35

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage (VCC = 1.2 V)

1.26 V

Supply Voltage (VDD and VCC1 = 3.3 V)

3.63 V

Maximum Input Voltage (REFCLKP/REFCLKN,

NIN/PIN)

1.26 V

Minimum Input Voltage (REFCLKP/REFCLKN,

NIN/PIN)

VEE − 0.4 V

Maximum Input Voltage (SDA, SCK, I2C_ADDR)

3.63 V

Minimum Input Voltage (SDA, SCK, I2C_ADDR)

VEE − 0.4 V

Maximum Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

Thermal Resistance

Thermal resistance is specified for the worst-case conditions,

that is, a device soldered in a circuit board for surface-mount

packages, for a 4-layer board with the exposed pad soldered to

VEE.

Table 5. Thermal Resistance

Package Type

θJA1

θJB2

θJC3

Unit

24-Lead LFCSP

°C/W

Junction to ambient.

Junction to board.

Junction to case.

ESD CAUTION

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