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MCP23017T-E/ML 데이터시트(PDF) 39 Page - Microchip Technology |
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MCP23017T-E/ML 데이터시트(HTML) 39 Page - Microchip Technology |
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39 / 48 page ![]() © 2007 Microchip Technology Inc. DS21952B-page 39 MCP23017/MCP23S17 28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN] with 0.55 mm Contact Length Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 28 Pitch e 0.65 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Width E 6.00 BSC Exposed Pad Width E2 3.65 3.70 4.20 Overall Length D 6.00 BSC Exposed Pad Length D2 3.65 3.70 4.20 Contact Width b 0.23 0.30 0.35 Contact Length L 0.50 0.55 0.70 Contact-to-Exposed Pad K 0.20 – – D EXPOSED D2 e b K E2 E L N NOTE 1 1 2 2 1 N A A1 A3 TOP VIEW BOTTOM VIEW PAD Microchip Technology Drawing C04-105B |
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