Data Sheet

AD8005

Rev. B | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

12.6 V

Internal Power Dissipation1

PDIP Package (N-8)

1.3 Watts

SOIC_N (R-8)

0.75 Watts

SOT-23 Package (RJ-5)

0.5 Watts

Input Voltage (Common Mode)

±VS ± 1 V

Differential Input Voltage

±3.5 V

Output Short Circuit Duration

Observe Power Derating Curves

Storage Temperature Range

–65°C to +125°C

Operating Temperature Range

–40°C to +85°C

Lead Temperature Range

(Soldering 10 sec)

+300°C

1 See Table 4.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for device in free air.

Table 4. Thermal Resistance

Package Type

θJA

Unit

8-Lead PDIP Package

90

°C/W

8-Lead SOIC_N Package

155

°C/W

5-Lead SOT-23 Package

240

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8005

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for plastic encapsulated

devices is determined by the glass transition temperature of the

plastic, approximately +150°C. Exceeding this limit temporarily

causes a shift in parametric performance due to a change in the

stresses exerted on the die by the package. Exceeding a junction

temperature of +175°C for an extended period can result in

device failure.

While the AD8005 is internally short circuit protected, this is

not sufficient to guarantee that the maximum junction temper-

ature (+150°C) is not exceeded under all conditions. To ensure

proper operation, it is necessary to observe the maximum

power derating curves shown in Figure 5.

Figure 5. Maximum Power Dissipation vs. Temperature

ESD CAUTION

–50

–30

–10

1030507090

–40

–20

0

20406080

AMBIENT TEMPERATURE (°C)

TJ = 150°C

2.0

1.5

1.0

0.5

0

8-LEAD PDIP PACKAGE

8-LEAD SOIC_N PACKAGES

5-LEAD SOT-23 PACKAGE