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Cross Section TMV® PoP

A

B

C

D

E

Body Size

(mm)

Package Interconnect - 2 Rows

Bottom Package

0.4 mm Pitch

(Full Matrix)

Max Die Size

Flip Chip

(mm)

Package Interconnect

Ball Center To Package

Edge (mm)

Matrix

Top Ball Count

10

23

168

529

7.00

6.00

11

26

192

676

8.00

7.00

12

18

128

400

< 7.50

0.475

13

19

136

450

< 8.00

0.650

TMV® Design Table For 0.4 mm Pitch 2 Row Stacked Interfaces

Cross Section TMV® PoP

Cross Section PSfcCSP

A

B

C

Body Size

(mm)

Package Interconnect

Die Size

(mm)

Matrix

Ball Count

10

19

136

< 6.00

11

21

152

< 7.00

12

23

168

< 8.00

13

25

184

< 9.00

14

27

200

< 9.50

15

29

216

< 10.00

PSfcCSP Design Table For 0.5 mm Pitch 2 Row

Stacked Interfaces

0.25-0.40 mm

A

D

B

C

TMV® Overall Stack Up Table (mm)

Symbol

Min

Max

Nom

A1 (Mounted, 0.4 pitch)

0.100

0.200

0.150

A2 (4L Laminate)

0.220

0.300

0.260

A3 (Mold Cap)

0.230

0.280

0.250

B1 (Stacked Gap)

0.020

0.080

0.050

B2 (2L Laminate)

0.100

0.160

0.130

B3 (Mold Cap)

0.370

0.430

0.400

Overall Package Height

1.140

1.340

1.240

A1

A2

A3

B1

B2

B3

C

B

A

B3

A1

B1

A3

A2

B2