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R5323K034B 데이터시트(PDF) 25 Page - RICOH electronics devices division |
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R5323K034B 데이터시트(HTML) 25 Page - RICOH electronics devices division |
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25 / 31 page ![]() PACKAGE INFORMATION PE-PLP1820-6-0611 POWER DISSIPATION (PLP1820-6) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plactic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-hole φ0.54mm × 30pcs Measurement Result (Topt=25 °C,Tjmax=125°C) Standard Land Pattern Power Dissipation 880mW Thermal Resistance θja=(125−25°C)/0.88W=114°C/W 0 50 100 25 75 85 125 150 Ambient Temperature ( °C) 0 400 200 600 800 880 1000 On Board 1200 40 Power Dissipation Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN 1.60 0.35 0.25 0.5 0.5 (Unit: mm) |
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