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STM32G473MB 데이터시트(PDF) 196 Page - STMicroelectronics

부품명 STM32G473MB
상세설명  Arm® Cortex®-M4 32-bit MCUFPU, up to 512 KB Flash, 170 MHz / 213 DMIPS, 128 KB SRAM, rich analog, math accelerator
PDF  229 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G473MB 데이터시트(HTML) 196 Page - STMicroelectronics

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Package information
STM32G473xB STM32G473xC STM32G473xE
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DS12712 Rev 5
6.2
WLCSP81 package information (B068)
This WLCSP is a 81-ball, 4.02 x 4.27 mm, 0.4 mm pitch wafer level chip scale package.
Figure 55. WLCSP81 - Outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
Table 106. WLCSP81 - Mechanical data
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A(2)
-
-
0.59
-
-
0.023
A1
-
0.18
-
-
0.007
-
A2
-
0.38
-
-
0.015
-
A3
-
0.025
-
-
0.001
-
b
0.22
0.25
0.28
0.009
0.010
0.011
D
4.00
4.02
4.04
0.157
0.158
0.159
B068_WLCSP81_DIE469_ME_V1
1
9
e1
e2
e
J
A
F
G
D
E
A
A2
A1
bbb Z
A3
A2
A1 BALL
LOCATION
DETAIL A
b
ccc
ddd
M
Z
Z
X Y
M
b(81x)
SEATING PLANE
z
BUMP
DETAIL A
ROTATED 90
eee Z
TOP VIEW
BOTTOM VIEW
FRONT VIEW
SIDE VIEW
A1
eee
(4X)



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