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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32G473MB 데이터시트(PDF) 197 Page - STMicroelectronics |
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STM32G473MB 데이터시트(HTML) 197 Page - STMicroelectronics |
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197 / 229 page  DS12712 Rev 5 197/229 STM32G473xB STM32G473xC STM32G473xE Package information 224 Figure 56. WLCSP81 - Footprint example E 4.25 4.27 4.29 0.167 0.168 0.169 e - 0.40 - - 0.016 - e1 - 3.20 - - 0.126 - e2 - 3.20 - - 0.126 - F(3) - 0.410 - - 0.016 - G(3) - 0.535 - - 0.021 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 1. Values in inches are converted from mm and rounded to 3 decimal digits. 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal and tolerances values of A1 and A2. 3. Calculated dimensions are rounded to the 3rd decimal place Table 107. WLCSP81 - Example of PCB design rules Dimension Values Pitch 0.4 mm Dpad 0,225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm Table 106. WLCSP81 - Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max B068_WLCSP81_DIE469_FP_V1 Dpad Dsm |
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