5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

-0.5

7

V

VI

Input voltage range(2)

-0.5

VCC + 0.5V

V

VO

Output voltage range(2)

-0.5

VCC + 0.5V

V

IIK

Input clamp current

VI < -0.5V or VI > VCC + 0.5V

±20

mA

IOK

Output clamp current

VO < -0.5V or VO > VCC + 0.5V

±50

mA

IO

Continuous output current

VO = 0 to VCC

±50

mA

Continuous output current through VCC or GND

±200

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

-65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage

4.5

5.5

V

VIH

High-level input voltage

2

V

VIL

Low-Level input voltage

0.8

V

VI

Input Voltage

0

VCC

V

VO

Output Voltage

0

VCC

V

IOH

High-level output current

-24

mA

IOL

Low-level output current

24

mA

Δt/Δv

Input transition rise or fall rate

20

ns/V

TA

Operating free-air temperature

-40

125

°C

5.4 Thermal Information

PACKAGE

PINS

THERMAL METRIC(1)

UNIT

RθJA

RθJC(top)

RθJB

ΨJT

ΨJB

RθJC(bot)

PW (TSSOP)

16

126.2

60.5

84.2

7.5

83.3

-

°C/W

BQB (WQFN)

16

91.2

95.1

61.4

18.0

61.2

38.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

SN74ACT595

SCASE37 – NOVEMBER 2024

www.ti.com

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