HE84G770B datasheet(32/61 Pages) KB

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King Billion Electronics Co., Ltd

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HE84G770

HE80004H SERIES

October 31, 2003

Version:V1.1

This specification is subject to change without notice. Please contact sales person for the latest version before use.

11. Oscillators

The MCU is equipped with two clock sources with a variety of selections on the types of oscillators to

choose from. The system designer can select oscillator types based on the cost target, timing accuracy

requirements etc. Crystal, Resonator or the RC oscillator can be used as fast clock source, components

should be placed as close to the pins as possible. The type of oscillator used is selected by mask option

MO_FXTAL.

MO_FXTAL

Fast clock type

RC Oscillator.

Crystal Oscillator.

FXI

FXO

Crystal Osc.

RC Osc.

The RC oscillator has a built-in capacitor. An external resistor is needed to connect from FXI to GND to

determine the oscillation frequency. The capacitance of internal RC oscillator is selected by mask option

MO_RCAP[2..0].

MO_RCAP[2:0]

Internal RC Cap. (pF)

000

001

010

011

100

101

110

111

The following table shows the combinations of R and C, and the resulting frequency. Please note that

oscillation frequency in the table only represents oscillation frequencies of certain samples. The actual

oscillation frequency may vary up to ±15% from lot to lot due to process parameter variations. User must

take this into consideration when using this chip in applications.

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