King Billion Electronics Co., Ltd

駿

億

電

子

股

份

有

限

公

司

HF88M02

January 16, 2004

Page 5 of 19

V1.11

This specification is subject to change without notice. Please contact sales person for the latest version before use.

Symbol

Pin No. I/O

Description

D7 ~ D0

21 ~ 17,

15 ~13

IO The Bi-directional Data I/O pins are used to input Starting Address, setting

the Expansion I/O direction and Output Registers, and to output ROM array

data during read operations, contents of I/O Registers and status of input

pins. The D7 ~ D7 float to high-impedance when the chip is deselected (CEn

high) or when the outputs are disabled.

5 Pad Location

VSS

D6

RS0

P00

D1

D5

CEN

P04

NC

WEN

P05

D3

D0

VDD

D4

P12

P01

P10

P16

P06

P14

OEN

P07

VDD

VSS

P17

P15

NC

P11

P03

RS1

RS2

D2

P13

NC

VDD

P02

D7

NC

NC

VSS

Die Size: X= 3110 µm, Y=2170 µm, and substrate is connected to GND.

Pad No.

Pin Name X Coord.e Y Coord.

Pad No.

Pin Name X Coord.

Y Coord.

1

P07

108.33

1931.75

22

P12

2975.87

382.79

2

P06

108.33

1744.31

23

OEN

2975.87

522.79

3

P05

108.33

1557.03

24

NC

2978.86

875.14

4

P04

108.33

1369.59

25

NC

2978.86

1035.14