| 전자부품 데이터시트 검색엔진 |
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STV7622 데이터시트(PDF) 22 Page - STMicroelectronics |
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STV7622 데이터시트(HTML) 22 Page - STMicroelectronics |
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22 / 32 page ![]() Pad dimensions and positions (in µm) STV7622 22/32 11 Pad dimensions and positions (in µm) The reference (x=0, y=0) is the centre of the die. Output pad pitch is 76.5 µm. Pad placement coordinate values correspond to the center of each bump pad center. Pad size is specified for bumping. Table 13. Pad placement and bump pad dimensions (in microns) Lead pad name Pad placements Bump dimensions X Y X Y TOP SIDE from left to right OUT192 -7303.1 624.2 43.5 65.6 OUT191 -7226.6 624.2 43.5 65.6 OUT190 -7150.1 624.2 43.5 65.6 OUT189 -7073.6 624.2 43.5 65.6 OUT188 -6997.1 624.2 43.5 65.6 OUT187 -6920.6 624.2 43.5 65.6 OUT186 -6844.1 624.2 43.5 65.6 OUT185 -6767.6 624.2 43.5 65.6 OUT184 -6691.1 624.2 43.5 65.6 OUT183 -6614.6 624.2 43.5 65.6 OUT182 -6538.1 624.2 43.5 65.6 OUT181 -6461.6 624.2 43.5 65.6 OUT180 -6385.1 624.2 43.5 65.6 OUT179 -6308.6 624.2 43.5 65.6 OUT178 -6232.1 624.2 43.5 65.6 OUT177 -6155.6 624.2 43.5 65.6 OUT176 -6079.1 624.2 43.5 65.6 OUT175 -6002.6 624.2 43.5 65.6 OUT174 -5926.1 624.2 43.5 65.6 OUT173 -5849.6 624.2 43.5 65.6 OUT172 -5773.1 624.2 43.5 65.6 OUT171 -5696.6 624.2 43.5 65.6 OUT170 -5620.1 624.2 43.5 65.6 OUT169 -5543.6 624.2 43.5 65.6 OUT168 -5467.1 624.2 43.5 65.6 OUT167 -5390.6 624.2 43.5 65.6 OUT166 -5314.1 624.2 43.5 65.6 |
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