TLP113

2007-10-01

2

Characteristic

Symbol

Rating

Unit

Forward current

20

mA

Pulse forward current

(Note 1)

40

mA

Peak transient forward

current

(Note 2)

1

A

Reverse voltage

5

V

Output current

25

mA

Output voltage

7

V

Supply voltage

(1 minute maximum)

7

V

Output power dissipation

40

mW

Operating temperature range

−40~85

°C

Storage temperature range

−55~125

°C

Lead solder temperature (10s)

260

°C

Isolation voltage

(AC, 1 min., RH ≤ 60%,

Note 4)

2500

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

(Note 1) 50% duty cycle, 1ms pulse width.

(Note 2) Pulse width≤1μs, 300pps.

Recommended Operating Conditions

Characteristic

Symbol

Min.

Typ.

Max.

Unit

Input voltage, low level

−3

0

1.0

V

Input current, high level

13*

16

20

mA

Supply voltage**

4.5

5

5.5

V

Fan out

(TTL load, each channel)

N

―

―

8

―

Operating temperature

0

―

70

°C

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

* 13mA is a guard banded value which allows for at least 20% CTR degradation.

Initial input current threshold value is 10mA or less.

**This item denotes operating ranges, not meaning of recommended operating conditions.