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4.4 Traceability and Identification

All STCC4 sensors include a laser marking for identification and traceability as shown in Figure 5. The first line

of the laser marking includes a filled circle as a pin-1 indicator, followed by the product name (i.e. STCC4). The

second line of the laser marking serves as an internal batch tracking code.

Figure 5. Laser marking illustration

4.5 Soldering Instructions

The STCC4 sensors are designed to withstand a soldering profile for Pb-free assembly based on IPC/JEDEC J-

STD-02016 in IR/Convection reflow ovens, as seen in Figure 6. Recommended conditions are peak temperature

TP = 260 °C, time within actual peak temperature tp = 30 s and a maximum ramp-down rate of < 4 °C/s. The

sensor is not compatible with vapor phase reflow soldering. The membrane on top of the cap must not be

removed or wetted with any liquid. Do not apply any board wash process step subsequently to the reflow

soldering. If the PCB hosting the sensor passes through multiple solder cycles, it is recommended to assemble

the sensor during the last solder cycle.

Figure 6. Recommended soldering profile based on IPC/JEDEC J-STD-020.

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IPC/JEDEC J-STD-020E, December 2014