CS

VOUT

FB

COMP

RAMP

AGND

SS

RT/ SYNC

VCC

LO

PGND

SW

HO

HB

VIN

DEMB

UVLO

VCCX

EN

CSG

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

FB

VIN

VCC

RT/ SYNC

HB

EN

L

LM5116

COMP

AGND

CSG

RAMP

SS

CS

PGND

LO

VOUT

HO

SW

UVLO

VCCX

DEMB

CSYNC

C VCC

VIN

CHB

COUT

VOUT

RFB2

RS

C RAMP

CSS

CHF

R T

CCOMP

RCOMP

RUV1

RUV2

VIN

CIN

RFB1

LM5116-HT

SLVSBS8B – OCTOBER 2013 – REVISED JANUARY 2014

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

TJ

PACKAGE

PART NUMBER

TOP-SIDE MARKING

–55°C to 175°C

JD

LM5116HJD

LM5116HJD

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

Typical Application

Connection Diagram

JD PACKAGE

(TOP VIEW)

2

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Product Folder Links: LM5116-HT