PCA8574_PCA8574A_2

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 02 — 14 May 2007

17 of 27

NXP Semiconductors

PCA8574/74A

14. Package outline

Fig 18. Package outline SOT38-1 (DIP16)

UNIT

A

max.

1

2

cE

e

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

99-12-27

03-02-13

A

min.

A

max.

b

max.

w

1.40

1.14

0.055

0.045

0.53

0.38

0.32

0.23

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.254

2.54

7.62

0.3

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7

0.51

3.7

0.15

0.021

0.015

0.013

0.009

0.01

0.1

0.02

0.19

050G09

MO-001

SC-503-16

c

(e )

1

A

L

e

D

Z

16

1

9

8

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

(1)

(1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1