PCA8574_PCA8574A_2

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 02 — 14 May 2007

22 of 27

NXP Semiconductors

PCA8574/74A

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

For further information on temperature profiles, refer to Application Note

AN10365

“Surface mount reflow soldering description”.

Table 9.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

°C)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

220

Table 10.

Lead-free process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

°C)

< 350

350 to 2000

> 2000

< 1.6

260

260

260

1.6 to 2.5

260

250

245

> 2.5

250

245

245

MSL: Moisture Sensitivity Level

Fig 22. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature