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TMP116, TMP116N

SBOS740A – MAY 2017 – REVISED MAY 2019

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Copyright © 2017–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

Two-Wire Interface Timing ........................................ 6

6.7

Typical Characteristics .............................................. 7

7

Detailed Description ............................................ 10

7.1

Overview ................................................................. 10

7.2

Functional Block Diagrams ..................................... 10

7.3

Feature Description................................................. 10

7.4

Device Functional Modes........................................ 12

7.5

Programming........................................................... 17

7.6

Registers Map ......................................................... 24

8

Application and Implementation ........................ 32

8.1

Application Information............................................ 32

9

Power Supply Recommendations ...................... 36

10

Layout................................................................... 36

10.1

Layout Guidelines ................................................. 36

10.2

Layout Example .................................................... 38

11

Device and Documentation Support ................. 39

11.1

Documentation Support ....................................... 39

11.2

Receiving Notification of Documentation Updates 39

11.3

Community Resources.......................................... 39

11.4

Trademarks ........................................................... 39

11.5

Electrostatic Discharge Caution ............................ 39

11.6

Glossary ................................................................ 39

12

Mechanical, Packaging, and Orderable

Information ........................................................... 39

4 Revision History

Changes from Original (May 2017) to Revision A

Page

•

Added Selectable Averaging feature ..................................................................................................................................... 1

•

Added thermal mass parameter to the Thermal Information table ........................................................................................ 4

•

Added tablenote to the temperature cycling and hysteresis parameter ................................................................................. 5

•

Added TI recommendation to not solder the thermal pad to the PCB in the Layout Guidelines section ............................. 36