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HD3SS212ZXHT 데이터시트(PDF) 16 Page - Texas Instruments |
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HD3SS212ZXHT 데이터시트(HTML) 16 Page - Texas Instruments |
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16 / 24 page ![]() 10 Layout 10.1 Layout Guidelines • Decoupling caps should be placed next to each power terminal on the HD3SS212. Take care to minimize the stub length of the race connecting the capacitor to the power pin. • Avoid sharing vias between multiple decoupling caps • Place vias as close as possible to the decoupling cop solder pad • Widen VDD/GND planes to reduce effect if static and dynamic IR drop • The VBUS traces/planes must be wide enough to carry maximum of 2-A current 10.2 Layout Example VDD3P3 GND SEL VBUS VDD3P3 VSS AX+ AX- BX+ BX- CX+ CX- Use controlled-impedance Transmission media for all Differential signals 3.3V Logic level VBUS traces wide enough to carry 2A current Figure 10-1. Layout Example HD3SS212 SLAS822D – DECEMBER 2011 – REVISED DECEMBER 2020 www.ti.com 16 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated |
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