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ISO7641FC 데이터시트(PDF) 20 Page - Texas Instruments |
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ISO7641FC 데이터시트(HTML) 20 Page - Texas Instruments |
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20 / 37 page ![]() OSC PWM VREF LPF VREF DCL OUT IN 0 1 S Isolation Barrier Low t Frequency Channel (DC...100 kbps) High t Frequency Channel (100 kbps...25 Mbps) Polarity and Threshold Selection Polarity and Threshold Selection Copyright © 2016, Texas Instruments Incorporated 20 ISO7631FM, ISO7631FC, ISO7641FC SLLSEC3F – SEPTEMBER 2012 – REVISED APRIL 2016 www.ti.com Product Folder Links: ISO7631FM ISO7631FC ISO7641FC Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Functional Block Diagram (continued) (1) Per JEDEC package dimensions. (2) Measured from input pin to ground. Figure 21. ISO7631FC and ISO7641FC Conceptual Block Diagram 9.3 Feature Description 9.3.1 Package Insulation and Safety-Related Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNIT L(I01) Minimum air gap (Clearance) Shortest terminal to terminal distance through air 8 mm L(I02)(1) Minimum external tracking (Creepage) Shortest terminal to terminal distance across the package surface 8 mm CTI Tracking resistance (Comparative Tracking Index) DIN EN 60112 (VDE 0303-11); IEC 60112 ≥400 V DTI Minimum Internal Gap (Internal Clearance) Distance through the insulation 0.014 mm CI (2) Input capacitance VI = VCC/2 + 0.4 sin (2πft), f = 1MHz, VCC = 5 V 2 pF spacer NOTE Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications. |
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