MSP430G2231-Q1

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SLAS787B – NOVEMBER 2011 – REVISED MARCH 2014

9.30 RAM

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

V(RAMh)

RAM retention supply voltage (1)

CPU halted

1.6

V

(1)

This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should

happen during this supply voltage condition.

9.31 JTAG and Spy-Bi-Wire Interface

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

fSBW

Spy-Bi-Wire input frequency

2.2 V, 3 V

0

20

MHz

tSBW,Low

Spy-Bi-Wire low clock pulse length

2.2 V, 3 V

0.025

15

µs

Spy-Bi-Wire enable time

tSBW,En

2.2 V, 3 V

1

µs

(TEST high to acceptance of first clock edge(1))

tSBW,Ret

Spy-Bi-Wire return to normal operation time

2.2 V, 3 V

15

100

µs

2.2 V

0

5

MHz

fTCK

TCK input frequency(2)

3 V

0

10

MHz

RInternal

Internal pulldown resistance on TEST

2.2 V, 3 V

25

60

90

k

Ω

(1)

Tools that access the Spy-Bi-Wire interface must wait for the maximum tSBW,En time after pulling the TEST/SBWTCK pin high before

applying the first SBWTCK clock edge.

(2)

fTCK may be restricted to meet the timing requirements of the module selected.

9.32 JTAG Fuse

(1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

VCC(FB)

Supply voltage during fuse-blow condition

TA = 25°C

2.5

V

VFB

Voltage level on TEST for fuse blow

6

7

V

IFB

Supply current into TEST during fuse blow

100

mA

tFB

Time to blow fuse

1

ms

(1)

Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to

bypass mode.

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