www.ti.com

PACKAGE OUTLINE

C

TYP

8.3

7.9

42X 0.635

44X

0.27

0.17

2X

13.335

(0.15) TYP

0 - 8

0.15

0.05

1.2

1.0

7.30

6.72

4.43

3.85

0.25

GAGE PLANE

0.75

0.50

A

NOTE 3

14.1

13.9

B

6.2

6.0

(0.15) TYP

NOTE 6

2X (0.6)

NOTE 6

2X (0.3)

NOTE 6

PowerPAD

TSSOP - 1.2 mm max height

DDV0044D

PLASTIC SMALL OUTLINE

4218830/A 08/2016

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MO-153.

5. The exposed thermal pad is designed to be attached to an external heatsink.

6. Features may differ or may not be present.

PowerPAD is a trademark of Texas Instruments.

TM

1

44

0.08

C A B

23

22

PIN 1 ID

AREA

EXPOSED

THERMAL

PAD

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 1.250