A192

DF17 Seriesq0.5mm Pitch Board to Board Connector

s Precautions

1. Recommended

Temperature Profile

(SMT)

Note1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that

there is a return to normal temperature between the first and second cycle.

Note2: The temperature profile indicates the board surface temperature at the point of contacts

with the connector terminals.

s The header is designed in a structure where contacts are exposed. Touching it with bare

hands would cause contact failure or electrostatic element damage.

s Where no board is mounted, the insertion or extraction will cause damage or contact deformation.

s Avoid retaining the board with the connector only, and fix the board by any other means than the connector.

s Excessive scoop insertion or extraction may result in damage.

s In the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.

s The color phase of this product may be slightly different from that of the formed product

according to the manufacturing lot. However, the difference doesn't affect the performance.

Soldering iron temperature: 350±3çoldering time: Within 2 seconds

0.15mm

Max 0.02mm in the connector center area, based on the both connector edges

Refer to the "Nylon Connector Use Hand book".

6. Cautions

2. Recommended Manual

Soldering Condition

(SMT)

3. Recommended

Screen Thickness

(SMT)

4. Board Warp(SMT)

5. Cleaning Condition

50

60sec max

Soldering

100

150

200

250

Time (sec.)

Temperature (ç)

0

100

150

200

250

50

Room temperature

300

90~120sec

Preheating

180ç

250ç

220ç

150ç

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.