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TS3011 데이터시트(PDF) 5 Page - STMicroelectronics |
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TS3011 데이터시트(HTML) 5 Page - STMicroelectronics |
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5 / 20 page ![]() Table 5. VCC = 2.7 V, VICM = VCC/2, Tamb = 25 °C (unless otherwise specified) Symbol Parameter Test conditions Min. Typ. Max. Unit VIO Input offset voltage (1) -7 -0.1 7 mV -40 °C < Tamb < 125 °C -9 9 ΔVIO Input offset voltage drift -40 °C < Tamb < 125 °C 5 20 µV/°C VHYST Input hysteresis voltage (2) 2 mV IIO Input offset current (3) 1 20 pA -40 °C < Tamb < 125 °C 100 IIB Input bias current 1 20 -40 °C < Tamb < 125 °C 100 ICC Supply current No load, output high 0.52 0.65 mA No load, output high, -40 °C < Tamb < 125 °C 0.9 No load, output low 0.66 0.89 No load, output low, -40 °C < Tamb < 125 °C 1.1 ISC Short circuit current Source 24 27 Sink 19 22 VOH Output voltage high Isource = 4 mA 2.48 2.52 V -40 °C < Tamb < 125 °C 2.40 VOL Output voltage low Isink = 4 mA 130 170 mV -40 °C < Tamb < 125 °C 220 CMRR Common-mode rejection ratio 0 < VICM < 2.7 V 52 70 dB TPLH Propagation delay, low to high output level (4) CL = 12 pF, RL = 1 MΩ, overdrive = 5 mV 16 ns CL = 12 pF, RL = 1 MΩ, overdrive = 15 mV 11 CL = 12 pF, RL = 1 MΩ, overdrive = 50 mV 9 13 TPHL Propagation delay, high to low output level (5) CL = 12 pF, RL = 1 MΩ, overdrive = 5 mV 16 CL = 12 pF, RL = 1 MΩ, overdrive = 15 mV 11 CL = 12 pF, RL = 1 MΩ, overdrive = 50 mV 9 13 TR Rise time (10 % to 90 %) CL = 12 pF, RL = 1 MΩ, overdrive = 100 mV 2.3 TF Fall time (90 % to 10 %) CL = 12 pF, RL = 1 MΩ, overdrive = 100 mV 1.8 1. The offset is defined as the average value of positive (VTRIP+) and negative (VTRIP-) trip points (input voltage differences) requested to change the output state in each direction. 2. Hysteresis is a built-in feature of the TS3011. It is defined as the voltage difference between the trip points. 3. Maximum values include unavoidable inaccuracies of the industrial tests. 4. Overdrive is measured with reference to the VTRIP+ point. 5. Overdrive is measured with reference to the VTRIP- point. TS3011 Electrical characteristics DS8604 - Rev 9 page 5/20 |
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