CC2640R2FYFVT.B datasheet(14/74 Pages) TI2

14 / 74 page

Table 7-3. Signal Descriptions – YFV Package (continued)

NAME

NO.

TYPE

DESCRIPTION

RF_N

RF I/O

Negative RF input signal to LNA during RX

Negative RF output signal to PA during TX

RF_P

RF I/O

Positive RF input signal to LNA during RX

Positive RF output signal to PA during TX

VDDR

Power

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(4) (2)

VDDR_RF

Power

1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(5) (2)

VDDS

Power

1.8-V to 3.8-V main chip supply(1)

VDDS2

Power

1.8-V to 3.8-V GPIO supply(1)

VDDS_DCDC

Power

1.8-V to 3.8-V DC/DC supply

X32K_Q1

Analog I/O

32-kHz crystal oscillator pin 1

X32K_Q2

Analog I/O

32-kHz crystal oscillator pin 2

X24M_N

Analog I/O

24-MHz crystal oscillator pin 1

X24M_P

Analog I/O

24-MHz crystal oscillator pin 2

GND

A4, B1, C6,

Power

Ground

(1)

For more details, see the technical reference manual (listed in Section 11.3).

(2)

Do not supply external circuitry from this pin.

(3)

For design consideration regarding noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™

Wireless MCU Technical Reference Manual

(4)

If internal DC/DC is not used, this pin is supplied internally from the main LDO.

(5)

If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

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