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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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CC2640R2FYFVT.B 데이터시트(PDF) 63 Page - Texas Instruments |
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CC2640R2FYFVT.B 데이터시트(HTML) 63 Page - Texas Instruments |
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63 / 74 page  NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. EXAMPLE BOARD LAYOUT 4219044/D 02/2022 www.ti.com VQFN - 1 mm max height RGZ0048A PLASTIC QUADFLAT PACK- NO LEAD SYMM SYMM LAND PATTERN EXAMPLE SCALE: 15X ( 5.15) 2X (6.8) 2X (6.8) 48X (0.6) 48X (0.24) 44X (0.5) 2X (5.5) 2X (5.5) 21X (Ø0.2) VIA TYP (R0.05) TYP NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED METAL SOLDER MASK OPENING EXPOSED METAL SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND 2X (1.26) 2X (1.26) 2X (1.065) 2X (1.065) 1 12 13 24 25 36 37 48 |
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