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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATING TABLE

TPS2550

TPS2551

SLVS736 – FEBRUARY 2008

This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields.

These circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to

MIL-STD-883C, Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than

maximum-rated voltages to these high-impedance circuits. During storage or handling the device leads should be shorted together

or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriate logic

voltage level, preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication

Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.

AVAILABLE OPTIONS AND ORDERING INFORMATION

DEVICE

AMBIENT

ENABLE

RECOMMENDED MAXIMUM

TEMPERATURE

(DRV)

(DBV)

CONTINUOUS LOAD CURRENT

TPS2550

Active low

TPS2550DRV

TPS2550DBV

1.1 A

–40

°C to 85°C

TPS2551

Active high

TPS2551DRV

TPS2551DBV

1.1 A

(1)

Add an R suffix to the device type for tape and reel.

over operating free-air temperature range unless otherwise noted

(1) (2)

VALUE

UNIT

Voltage range on IN, OUT, EN or EN, ILIM, FAULT

–0.3 to 7

V

Voltage range from IN to OUT

–7 to 7

V

Continuous output current

Internally limited

See "Dissipation Rating

Continuous total power dissipation

Table"

FAULT sink current

25

mA

ILIM source current

1

mA

HBM

2

kV

ESD

CDM

500

V

Maximum junction temperature

–40 to 150

°C

Storage temperature

–65 to 150

°C

Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds

300

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Voltages are referenced to GND unless otherwise noted.

BOARD

PACKAGE

THERMAL

THERMAL

DERATING

RESISTANCE

RESISTANCE

POWER

FACTOR ABOVE

POWER

POWER

θ

JA

θ

JC

RATING

RATING

RATING

DBV

350

°C/W

55

°C/W

285 mW

2.85 mW/

°C

155 mW

114 mW

DBV

160

°C/W

55

°C/W

625 mW

6.25 mW/

°C

340 mW

250 mW

DRV

140

°C/W

20

°C/W

715 mW

7.1 mW/

°C

395 mW

285 mW

DRV

75

°C/W

20

°C/W

1330 mW

13.3 mW/

°C

730 mW

530 mW

(1)

The JEDEC low-K (1s) board used to derive this data was a 3in

× 3in, two-layer board with 2-ounce copper traces on top of the board.

(2)

The JEDEC high-K (2s2p) board used to derive this data was a 3in

× 3in, multilayer board with 1-ounce internal power and ground

planes and 2-ounce copper traces on top and bottom of the board.

2

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