L9965P datasheet(100/104 Pages) STMICROELECTRONICS

100 / 104 page

3.9

Oscillators ................................................................... 60

3.9.1

Main oscillator and aux oscillator............................................ 60

3.9.2

Oscillator monitor ....................................................... 60

3.10

GPIOs....................................................................... 61

3.10.1

GPIOs electrical parameters ............................................... 61

3.11

Internal monitors .............................................................. 62

3.12

Die temperature (TJ) monitor .................................................... 62

3.12.1

Die temperature monitor electrical parameters ................................. 62

3.13

Ground loss monitor (GNDMON) ................................................ 63

3.13.1

Ground loss monitor diagnostics ............................................ 63

3.13.2

Ground Loss monitor electrical parameters.................................... 63

3.14

Serial peripheral interface (SPI) ................................................. 64

3.14.1

SPI electrical parameters ................................................. 65

3.14.2

SPI register map ........................................................ 65

3.15

Configuration Lock ............................................................ 81

3.15.1

Configuration lock electrical parameters ...................................... 81

3.16

Software reset (SW_RST) ...................................................... 82

3.17

Configuration integrity check (CONF_CRC) ....................................... 82

3.17.1

Configuration integrity check electrical parameters .............................. 82

3.18

Non-volatile memory (NVM)..................................................... 82

3.18.1

NVM read/write operations ................................................ 83

3.18.2

NVM data integrity checks................................................. 84

3.18.3

NVM electrical parameters ................................................ 84

Application scenarios.............................................................85

4.1

Typical application circuit ....................................................... 85

4.1.1

12 V battery with MCU and ERBST mounted .................................. 85

4.1.2

12 V DC-DC with MCU and ERBST mounted .................................. 86

4.1.3

12 V DC-DC with L9965C and ERBST mounted ................................ 87

4.1.4

24 V DC-DC with MCU and ERBST not mounted ............................... 88

4.1.5

Bill of materials (BOM) ................................................... 89

4.2

Device positioning in BMS application ............................................ 90

Mission profile....................................................................91

Package information..............................................................92

6.1

VFQFN32 (5x5x0.9 mm 32+4L WETT. FLANKS) package information ................. 92

6.2

TQFP32L (7x7x1 mm 32+4L exposed pad down) package information ................ 95

Revision history .......................................................................98

L9965P

Contents

DS14702 - Rev 4

page 100/104

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