INA745AIRELR datasheet(38/50 Pages) TI2

부품명	INA745AIRELR

상세설명	INA745x 40V, 16-Bit, Precision I2C Output Digital Power Monitor With EZShunt™ Technology

PDF	50 Pages

Scroll/Zoom	100%

제조업체	TI2 [Texas Instruments]

홈페이지	https://www.ti.com

Logo

38 / 50 page

8.4.2 Layout Example

Address Lines A1, A0 via to

connect directly to VS, GND, SDA,

or SCL to set device address

I2C bus connections for clock and data

(pullup resistors not shown)

Place Vias connecting to inner or

bottom layers as close as possible to

the device. The number of vias

required depends on operational

current and ambient conditions

Device Bypass Capacitor

TI Device

IS+

All vias close to the pin pads must be tented.

All vias are either 8 mil/18 mil or 15 mil/25 mil with a 5 mill annular ring.

The distance between the IS+ and IS– power pours is 8 mil.

See EVM User's Guide for more specific layout recommendations and layers.

Figure 8-5. INA745x Layout Example

INA745A, INA745B

SBOSAC3B – JULY 2023 – REVISED AUGUST 2025

www.ti.com

Submit Document Feedback

Product Folder Links: INA745A INA745B

INA745AIRELR 데이터시트(PDF) 38 Page - Texas Instruments