A

A

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PACKAGE OUTLINE

3.1

2.9

5.1

4.9

1.0

0.8

0.05

0.00

2X 3

10X 0.6

2X 1.5

12X 0.5

0.3

18X 0.35

0.25

2X 1.0

0.8

2X 0.55

0.45

0.13 MIN

4X 0.75

(0.2) TYP

(0.13)

(0.19) TYP

4X (R0.2)

VQFN - 1 mm max height

REL0014A

PLASTIC QUAD FLATPACK - NO LEAD

4228616/A 04/2022

0.08 C

0.1

C A B

0.05

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PIN 1 INDEX AREA

SEATING PLANE

SYMM

SYMM

1

6

7

8

13

14

SCALE 3.000

A-A40.000

SECTION A-A

TYPICAL

A

B

C

INA745A, INA745B

SBOSAC3B – JULY 2023 – REVISED AUGUST 2025

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