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GQM1555C2DR10WB01 데이터시트(PDF) 6 Page - Murata Manufacturing Co., Ltd |
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GQM1555C2DR10WB01 데이터시트(HTML) 6 Page - Murata Manufacturing Co., Ltd |
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6 / 32 page ![]() Table A Capacitance Change between at Reference Temp. and at each Temp. (%) Substrate Bending test Except for Substrate Bending test ・Test substrate ・Test substrate Material JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin) Material JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin) Thickness 0.8mm Thickness 1.6mm or 0.8mm Copper Foil Thickness 0.035mm Copper Foil Thickness 0.035mm Kind of Solder Sn-3.0Ag-0.5Cu(Lead Free Solder) Kind of Solder Sn-3.0Ag-0.5Cu(Lead Free Solder) ・Land Dimension ・Land Dimension ・Pressurization Method 0.4 1.5 0.5 GQM15 0.4 1.5 0.5 GQM15 Type Dimension(mm) a b c a b c 0.25 -0.11 Type Dimension(mm) 5C 0.58 -0.24 0.4 -0.17 Char. -55℃ -30℃ -10℃ Max. Min. Max. Min. Max. Min. GQM1555C2DR10WB01-01A 6 |
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