Characteristics

STTH1R04-Y

6/12

DocID024449 Rev 2

Figure 13: Thermal resistance junction to ambient

total versus copper surface under each lead (SMB)

R

th (j -a) ( C/W)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMB

°

S

CU(cm²)

epoxy printed board FR4, copper thickness Cu = 35 µm